Determining compute and communication
demands of computer vision (perception by sensors) and vehicle dynamics
(path planning, trajectory control) methods while considering
requirements for reliability, cost and functional safety based on IP
blocks from HiSilicon Kunpeng and Ascend chip series.
Evaluation of the hardware feasibility,
programming effort and performance of Near-Data Processing (NDP) on
memory modules for server applications (DIMM-NDP). Building on standard
IP, NDP units enhance the MediaController (MedC) on a memory module.
The MedC is a discrete buffer chip positioned side-by-side the DRAM
devices on the module and needed for forthcoming interface standards
like JEDEC NVDIMM-P and Gen-Z. DIMM-NDP employs unmodified standard DRAM chips
and exploits unused rank-level bandwidth on DIMM, such that we follow
the economy of scale of manufacturing standard DRAM, such as DDR4/DDR5. The memory module appears as normal Load-Reduced DIMM
if NDP is switched off.
Simulation results show up to 6.3x better
performance for bandwidth-limited applications, representing 79% of the
theoretical peak of the evaluated configuration. We complement the evaluation with feasibility checks
for DIMM-like form factors to offer 32GB to 128GB capacity per DIMM,
hardware overhead costs (below 20%), and power envelopes for standard
(13W) and custom DIMMs (40W).
Benchmarking and microarchitecture analysis of HiSilicon Hi1612/1610
generation of ARM-based multicore server chipsets with elementary tests
(e.g., stream, lmbench) and app-level benchmarks (SPEC CPU, OMP,
jbb2015) to determine microarchitectural improvements with respect to
fairness, latency and utilization of the uncore (DDR3/DDR4 memory
subsystem and interconnect) for future HiSilicon Kunpeng products. I
also assessed the feasibility of integrating forthcoming interface
standards (Gen-Z, JEDEC NVDIMM-P, DDR5) for use with near and far
memory, as well as hybrid memory solutions (DRAM plus NVM).
M. Gries, P. Cabré, J. Gago: Performance Evaluation and Feasibility Study of Near-data Processing on DRAM Modules (DIMM-NDP) for Scientific Applications, Technical Report MRC-2019-04-15-R1, Munich Research Center, Huawei Technologies Duesseldorf GmbH, April 2019. pdf available at HAL archive